Semiconductor device and method of manufacturing semiconductor device

ABSTRACT

A plug electrode is subject to etch back to remain in a contact hole and expose a barrier metal on a top surface of an interlayer insulating film. The barrier metal is subject to etch back, exposing the top surface of the interlayer insulating film. Remaining element structures are formed. After lifetime is controlled by irradiation of helium or an electron beam, hydrogen annealing is performed. During the hydrogen annealing, the barrier metal is not present on the interlayer insulating film covering a gate electrode, enabling hydrogen atoms to reach a mesa part, whereby lattice defects generated in the mesa part by the irradiation of helium or an electron beam are recovered, recovering the gate threshold voltage. Thus, predetermined characteristics of a semiconductor device having a structure where a plug electrode is provided in a contact hole, via barrier metal are easily and stably obtained when lifetime control is performed.

CROSS REFERENCE TO RELATED APPLICATIONS

This is a divisional application of U.S. application Ser. No. 16/204,791filed on Nov. 29, 2018 which is a continuation application ofInternational Application PCT/JP2017/033604 filed on Sep. 15, 2017 whichclaims priority from a Japanese Patent Application No. 2016-183126 filedon Sep. 20, 2016, the contents of which are incorporated herein byreference.

BACKGROUND 1. Field

Embodiments of the invention relate to a semiconductor device and amethod of manufacturing a semiconductor device.

2. Description of Related Art

Conventionally, in a semiconductor device having a trench gate structurein which an insulated gate constituted by a metal oxide filmsemiconductor (MOS) is embedded in a trench formed in a semiconductorsubstrate, trench pitch (interval at which trenches are disposed) isreduced to improve characteristics. Reduction of the trench pitch,reduces a width (mesa part) between adjacent trenches, whereby a widthof a contact hole forming a contact (electrical contact part) of a frontelectrode and a semiconductor part decreases. When a sputteringtechnique is used to embed the front electrode in the contact holehaving a small width, voids occur in the front electrode.

A structure (hereinafter, first conventional structure) known as astructure to resolve this problem, includes a plug electrode embedded ina contact hole. The plug electrode contains, as a material, tungsten(W), which has a high embedding property. The plug electrodeelectrically connects a front electrode and a semiconductor part. Astructure of a conventional semiconductor device will be describedtaking as an example, a vertical insulated gate bipolar transistor(IGBT) having a trench gate structure depicted in FIG. 24 . FIG. 24 is across-sectional view of a structure of a conventional semiconductordevice.

In the first conventional structure depicted in FIG. 24 , a plugelectrode 212 is embedded in a contact hole 210 a. Tungsten, a materialof the plug electrode 212, has poor adhesiveness with silicon (Si), amaterial of a semiconductor substrate 200. Therefore, a barrier metal211 having high adhesiveness with the semiconductor part and made of ametal enabling formation of an ohmic contact with the semiconductor partis provided between the plug electrode 212 and a semiconductor part(n⁺-type emitter region 203). The barrier metal 211, for example, is ametal film constituted by a titanium (Ti) film and a titanium nitride(TiN) film that are sequentially stacked.

The barrier metal 211 is provided along an inner wall of the contacthole 210 a and a surface of the interlayer insulating film 210, andcovers the surface of the interlayer insulating film 210. A frontelectrode 213 is in contact with the barrier metal 211 and the plugelectrode 212 on the interlayer insulating film 210, and is electricallyconnected with a p-type base region 202 and the n⁺-type emitter region203. In FIG. 24 , while a trench gate structure on a front surface sideof the semiconductor substrate 200 is depicted, a p⁺-type collectorregion and a collector electrode on a rear surface side are notdepicted. Reference numerals 201, 204, 205, 206, and 207 are an n⁻-typedrift layer, a MOS gate, a trench, gate insulating film, and a gateelectrode.

To control lifetime of a semiconductor device having such a trench gatestructure, helium (He) or an electron beam may irradiated to introduceinto the drift layer, lattice defects that are lifetime killers. In thiscase, voids (V) (hereinafter, lattice defects) are also generated in themesa part and gate threshold voltage decreases. Therefore, afterirradiation of helium or an electron beam, heat treatment (hydrogenannealing) has to be performed in a hydrogen (H₂) atmosphere forrecovery of lattice defects in the mesa part and for recovery of thegate threshold voltage. During this hydrogen annealing, aluminum (Al)through which hydrogen atoms can pass is used as a material of the frontelectrode 213 so that the hydrogen atoms in the hydrogen atmosphere willpass through the front electrode 213 and reach the mesa part.

However, when the plug electrode 212 is embedded in the contact hole 210a, via the barrier metal 211, as described, the entire surface of theinterlayer insulating film 210 is covered by the barrier metal 211.Therefore, during the hydrogen annealing, diffusion of the hydrogenatoms from a front electrode 213 side toward the interlayer insulatingfilm 210 is suppressed by the barrier metal 211. As a result, since thehydrogen atoms do not reach the surface of the semiconductor substrate200, recovery of the lattice defects in the mesa part cannot occur. Inother words, when lifetime control is performed in a semiconductordevice having a structure in which the plug electrode 212 is embedded inthe contact hole 210 a, via the barrier metal 211, recovery of the gatethreshold voltage that decreases due to the lifetime control cannot berecovered.

As a method of solving this problem, one method proposes forming a firstmetal film (metal film in contact with a semiconductor part) of thebarrier metal using a group VIII metal material such as nickel (Ni) orcobalt (Co) instead of titanium (for example, refer to JapaneseLaid-Open Patent Publication No. 2011-181840). In Japanese Laid-OpenPatent Publication No. 2011-181840, by changing the material of thefirst metal film of the barrier metal, during the hydrogen annealingperformed after the electron beam irradiation, etc., occlusion of thehydrogen atoms in the first metal film is prevented.

According to another proposed method, when a titanium-tungsten (TiW)based barrier metal is formed on a device main surface by sputtering,titanium concentration of the TiW target is set to be in a range from 2%by weight to 8% by weight (e.g., refer to Japanese Laid-Open PatentPublication No. 2012-069861). In Japanese Laid-Open Patent PublicationNo. 2012-069861, a titanium concentration of a metal film containingtitanium is controlled, weakening a hydrogen trap effect and securing arecovery effect of the gate threshold voltage by hydrogen annealing.

According to yet another method, at a location where a semiconductorpart and a front electrode contact a barrier metal is disposed, and in apart where a semiconductor part and the front electrode do not contact,the barrier metal is not disposed (e.g., refer to Japanese Laid-OpenPatent Publication No. H06-310729). In Japanese Laid-Open PatentPublication No. H06-310729, the barrier metal is selectively removed bypatterning, whereby the barrier metal remains continuously from thesurface of the semiconductor part only at a side surface (side wall of acontact hole) of the interlayer insulating film.

Further, as a method of selectively removing a barrier metal, a methodhas been proposed in which an excess tungsten film above a contact holeis removed by a chemical mechanical polishing (CMP) process, and abarrier metal of a surface of an interlayer insulating film is alsoremoved by the CMP process (e.g., refer to PublishedJapanese-Translation of PCT Application, Publication No. 2010-503224(paragraph 0029, FIGS. 6, 7)).

Further, as a method of preventing degradation of electricalcharacteristics of the gate threshold voltage, a method has beenproposed in which electromagnetic waves are irradiated, thereby heatingan interlayer insulating film and performing heat treatment (reflow),whereby unevenness generated at a surface of the interlayer insulatingfilm during deposition is planarized (e.g., refer to Japanese Laid-OpenPatent Publication No. H07-249629 (paragraph 0013, FIG. 2).

SUMMARY

According to an embodiment of the present invention, a method ofmanufacturing a semiconductor device includes forming an insulating filmon a first main surface of a semiconductor substrate; forming a contacthole penetrating the insulating film in a depth direction and reachingsemiconductor substrate; forming a metal film from a surface of theinsulating film and spanning a semiconductor part of the semiconductorsubstrate exposed in the contact hole, the metal film having highadhesiveness with the semiconductor part; forming a metal layer on asurface of the metal film so as to be embedded in the metal film in thecontact hole; performing etch back of the metal layer, removing a partof the metal layer excluding a part embedded in the contact hole, andexposing the metal film; performing etch back of an exposed part of themetal film, and exposing the insulating film; irradiating a light ion oran electron beam on the semiconductor substrate; and performing heattreatment in a hydrogen atmosphere and recovering lattice defectsgenerated by irradiating the light ion or the electron beam.

In the embodiment, forming the insulating film includes forming as theinsulating film, a silicon oxide film containing boron at an impurityconcentration in a range from 2.6 wt % to 3.8 wt % and phosphorus at animpurity concentration in a range from 3.6 wt % to 4.4 wt %.

In the embodiment, performing etch back of the metal layer includesperforming etch back of the metal layer until a surface of the metallayer is positioned within the contact hole.

In the embodiment, performing etch back of the exposed part of the metalfilm includes performing etch back of the metal film so that of theinsulating film, an upper end of a side surface forming a side wall ofthe contact hole is exposed.

In the embodiment, forming the contact hole includes forming the contacthole and forming a first groove in a part of the semiconductor substrateexposed in the contact hole, and forming the metal film includes formingthe metal film so as to be embedded in the first groove.

In the embodiment, forming the insulating film includes forming theinsulating film to have a thickness that is at least equal to a width ofthe contact hole.

In the embodiment, the method further includes forming a gate electrodeon a gate insulating film, in a trench formed at a predetermined depthfrom the first main surface of the semiconductor substrate, the gateelectrode being formed before forming the insulating film. Forming thegate electrode includes forming the gate electrode so that a surface ofthe gate electrode is within the trench. Forming the insulating filmincludes: forming the insulating film so as to cover the gate electrode,and forming the insulating film to have at a part thereof other than apart on the gate electrode, a thickness that is at least equal to awidth of the contact hole.

In the embodiment, forming the gate electrode includes disposing thetrench in plural at an interval narrower than a width of the trench.

In the embodiment, performing the heat treatment includes recovering thelattice defects generated in a part of the semiconductor substratesandwiched between adjacent trenches.

In the embodiment, forming the gate electrode includes: forming thetrench in plural in a first formation region and a second formation ofthe semiconductor substrate that is of a first conductivity type, thefirst formation region having a first semiconductor element formedtherein and the second formation region having a second semiconductorelement formed therein; forming the gate electrode on the gateinsulating film in the trench; forming a first semiconductor region of asecond conductivity type in a part of the semiconductor substratesandwiched between adjacent trenches of the plural trenches, the firstsemiconductor region being formed so as to oppose the gate electrodeacross the gate insulating film; and selectively forming a secondsemiconductor region of the first conductivity type in the firstsemiconductor region of the first formation region, the secondsemiconductor region being formed so as to oppose the gate electrodeacross the gate insulating film. The method further includes afterperforming etch back of the exposed part of the metal film and beforeirradiating the light ion or the electron beam: forming a firstelectrode in contact with the first semiconductor region and the secondsemiconductor region of the first formation region and in contact withthe first semiconductor region of the second formation region; formingin the first formation region, a third semiconductor region of thesecond conductivity type in a surface layer on a second main surface ofthe semiconductor substrate, and forming in second formation region, afourth semiconductor region of the first conductivity type in thesurface layer on the second main surface of the semiconductor substrate,the fourth semiconductor region having an impurity concentration that ishigher than that of the semiconductor substrate; and forming a secondelectrode in contact with the third semiconductor region and the fourthsemiconductor region.

In the embodiment, forming the metal film includes forming as the metalfilm, a titanium film and titanium nitride film that are sequentiallystacked.

In the embodiment, forming the metal layer includes forming as the metallayer, a tungsten layer.

According to another embodiment of the present invention, asemiconductor device includes a plurality of trenches provided at apredetermined depth from a first main surface of a semiconductorsubstrate; a gate electrode provided in a gate insulating film in theplurality of trenches; an insulating film provided on the first mainsurface of the semiconductor substrate and covering the gate electrode;a contact hole penetrating the insulating film in a depth direction andreaching the semiconductor substrate; a metal film provided from a sidewall of the contact hole and spanning a surface of a semiconductor partof the semiconductor substrate exposed in the contact hole, the metalfilm having a high adhesiveness with the semiconductor part; a metallayer embedded in the metal film in the contact hole; and a firstelectrode provided at a surface of the metal layer and the insulatingfilm. A surface of the gate electrode is positioned within the trench.

In the embodiment, the insulating film is a silicon oxide filmcontaining boron at an impurity concentration in a range from 2.6 wt %to 3.8 wt % and phosphorus at an impurity range from 3.6 wt % to 4.4 wt%.

In the embodiment, the insulating film has a part that is on the gateelectrode and that has a thickness equal to a sum of a thickness of apart of the insulating film other than the part on the gate electrodeand a depth from the first main surface of the semiconductor substrateto the surface of the gate electrode.

In the embodiment, lattice defects are introduced in a part of thesemiconductor substrate other than a part sandwiched between adjacenttrenches of the plurality of trenches, the lattice defects beingintroduced by irradiation of light ions or an electron beam.

In the embodiment, the metal film is positioned closer to thesemiconductor part than is a corner part where a surface of theinsulating film facing toward the first electrode and a side surface ofthe insulating film exposed at the contact hole meet.

In the embodiment, a second groove having a slit shape is provided in apart of the metal film and penetrates the metal film in a direction ofthickness.

In the embodiment, the second groove penetrates the metal film in thedirection of thickness and reaches a surface of the insulating filmfacing toward the first electrode.

In the embodiment, the first electrode covers surfaces of the insulatingfilm and the metal layer overall.

In the embodiment, the first electrode has a stacked structure in whichtwo or more metal electrode films of differing materials aresequentially stacked, and a lowermost metal electrode film of the two ormore metal electrode films is an aluminum film or an aluminum alloyfilm, and covers a part of at least one of the insulating film and themetal layer.

In the embodiment, the first electrode includes a nickel film or anickel alloy film stacked as an upper layer metal electrode film on thelowermost metal electrode film.

Objects, features, and advantages of the present invention arespecifically set forth in or will become apparent from the followingdetailed description of the invention when read in conjunction with theaccompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a plan view of an example of a planar layout of asemiconductor device manufactured by a method of manufacturing asemiconductor device according to a first embodiment;

FIG. 2 is a cross-sectional view of a structure at cutting line A-A′ inFIG. 1 ;

FIG. 3 is a cross-sectional view of the structure at cutting line B-B′in FIG. 1 ;

FIG. 4 is an enlarged view of a cross-section near a contact hole inFIG. 2 ;

FIG. 5A is a flowchart depicting an outline of the method ofmanufacturing the semiconductor device according to the firstembodiment;

FIG. 5B is a flowchart depicting an outline of the method ofmanufacturing the semiconductor device according to the firstembodiment;

FIG. 6 is a plan view of the semiconductor device according to the firstembodiment;

FIG. 7 is a cross-sectional view of the semiconductor device accordingto the first embodiment during manufacture;

FIG. 8 is a plan view of the semiconductor device according to the firstembodiment during manufacture;

FIG. 9A is a cross-sectional view of the semiconductor device accordingto the first embodiment during manufacture;

FIG. 9B is a cross-sectional view of the semiconductor device accordingto the first embodiment during manufacture;

FIG. 10 is a plan view of the semiconductor device according to thefirst embodiment during manufacture;

FIG. 11A is a cross-sectional view of the semiconductor device accordingto the first embodiment during manufacture;

FIG. 11B is a cross-sectional view of the semiconductor device accordingto the first embodiment during manufacture;

FIG. 12A is a cross-sectional view of the semiconductor device accordingto the first embodiment during manufacture;

FIG. 12B is a cross-sectional view of the semiconductor device accordingto the first embodiment during manufacture;

FIG. 13A is a cross-sectional view of the semiconductor device accordingto the first embodiment during manufacture;

FIG. 13B is a cross-sectional view of the semiconductor device accordingto the first embodiment during manufacture;

FIG. 14A is a cross-sectional view of the semiconductor device accordingto the first embodiment during manufacture;

FIG. 14B is a cross-sectional view of the semiconductor device accordingto the first embodiment during manufacture;

FIG. 15A is a cross-sectional view of the semiconductor device accordingto the first embodiment during manufacture;

FIG. 15B is a cross-sectional view of the semiconductor device accordingto the first embodiment during manufacture;

FIG. 16A is a cross-sectional view of the semiconductor device accordingto the first embodiment during manufacture;

FIG. 16B is a cross-sectional view of the semiconductor device accordingto the first embodiment during manufacture;

FIG. 17A is a cross-sectional view of the semiconductor device accordingto the first embodiment during manufacture;

FIG. 17B is a cross-sectional view of the semiconductor device accordingto the first embodiment during manufacture;

FIG. 18 is a cross-sectional view schematically depicting a state afterreflow of an interlayer insulating film of a semiconductor deviceaccording to a first example;

FIG. 19 a cross-sectional view schematically depicting a state afterreflow of an interlayer insulating film of a semiconductor device forcomparison;

FIG. 20 is characteristics diagram of gate threshold voltagecharacteristics of a semiconductor device according to a second example;

FIG. 21 is a cross-sectional view schematically depicting a normal stateof a front electrode of a semiconductor device according to a thirdexample after wiring;

FIG. 22 is a cross-sectional view schematically depicting a state inwhich a gap of the front electrode of the semiconductor device accordingto the third example occurs after wiring;

FIG. 23 is a diagram depicting a problem occurring with a firstconventional structure depicted in FIG. 24 ;

FIG. 24 is a cross-sectional view of a structure of a conventionalsemiconductor device;

FIG. 25 is a cross-sectional view of a structure of the semiconductordevice according to a second embodiment;

FIG. 26 is a plan view of a layout when viewing a slit of a barriermetal in FIG. 25 from a front surface side of a semiconductor substrate;

FIG. 27 is a plan view of another example of a layout when viewing aslit of the barrier metal in FIG. 25 from the front surface side of thesemiconductor substrate;

FIG. 28 is a plan view of another example of a layout when viewing aslit of the barrier metal in FIG. 25 from the front surface side of thesemiconductor substrate;

FIG. 29 is a plan view of a layout when viewing a semiconductor moduleaccording to a third embodiment from a front surface side of asemiconductor chip; and

FIG. 30 is a cross-sectional view of a structure at cutting line H-H′ inFIG. 29 .

DESCRIPTION OF EMBODIMENTS

First, problems associated with the related arts will be described. Asdescribed above, in the first conventional structure depicted in FIG. 24, the entire surface of the interlayer insulating film 210 is covered bythe barrier metal 211 and therefore, the recovery effect of the gatethreshold voltage by hydrogen annealing is not obtained. This problem issolved by a configuration in which the barrier metal is not disposed ina part where a semiconductor part and the front electrode are not incontact like that in Japanese Laid-Open Patent Publication No.H06-310729. In this case, the recovery effect of the gate thresholdvoltage by hydrogen annealing may be obtained to an extent equal to thatof a conventional structure (a structure in which no plug electrode isused: hereinafter, the second conventional structure) in which a frontelectrode made of aluminum is embedded in a contact hole.

Nonetheless, in Japanese Laid-Open Patent Publication No. H06-310729, aproblem arises in that since the barrier metal (part of the barriermetal excluding the part formed at the inner wall of the contact hole)on the interlayer insulating film is selectively removed by patterning,the number of processes increases such as for forming a mask for thepatterning. Further, when the barrier metal on the interlayer insulatingfilm is removed by a CMP such as in Published Japanese-Translation ofPCT Application, Publication No. 2010-503224, a problem arises in thatcost increases. Further, in addition to the problem of not obtaining therecovery effect for the gate threshold voltage as described above, thefirst conventional structure depicted in FIG. 24 has the followingproblem.

FIG. 23 is a diagram depicting a problem occurring with the firstconventional structure depicted in FIG. 24 . In the first conventionalstructure depicted in FIG. 24 , to increase the adhesiveness between thefront electrode 213 and wiring, the front electrode 213 may have astacked structure in which, for example, a nickel (Ni) film 215 havinghigh adhesiveness with solder is stacked on an aluminum film 214. In thefront electrode 213 having such a stacked structure, when a gap 221occurs in the aluminum film 214 due to the effects of foreign matter,etc. as depicted in FIG. 23 , at the location of the gap 221 in thealuminum film 214, the barrier metal 211 and the plug electrode 212 areexposed and contact the nickel film 215.

The barrier metal 211 and the nickel film 215 have high adhesion to eachother and over a wide range of a surface 210 b (hereinafter, topsurface) of the interlayer insulating film 210, the barrier metal 211and the nickel film 215 are adhered to each other (part encompassed bydashed line indicated by reference numeral 222). Therefore, duringimplementation of the semiconductor substrate (semiconductor chip) 200or heat cycles thereafter, heat stress applied to the interlayerinsulating film 210 due to temperature increase of the nickel film 215is great, whereby a crack 223 in the interlayer insulating film 210 maybe formed, the barrier metal 211 or the interlayer insulating film 210may peel, etc. As a result, insulation by the interlayer insulating film210 may decrease, leak current may increase, predeterminedcharacteristics may not be obtained, etc.

Embodiments of a semiconductor device and a method of manufacturing asemiconductor device according to the present invention will bedescribed in detail with reference to the accompanying drawings. In thepresent description and accompanying drawings, layers and regionsprefixed with n or p mean that majority carriers are electrons or holes.Additionally, + or − appended to n or p means that the impurityconcentration is higher or lower, respectively, than layers and regionswithout + or −. In the description of the embodiments below and theaccompanying drawings, main portions that are identical will be giventhe same reference numerals and will not be repeatedly described.

A structure of a reverse conducting insulated-gate bipolar transistor(RC-IGBT) will be described as an example of a semiconductor devicefabricated (manufactured) by a method of manufacturing a semiconductordevice according to a first embodiment. FIG. 1 is a plan view of anexample of a planar layout of the semiconductor device manufactured bythe method of manufacturing the semiconductor device according to thefirst embodiment. FIG. 2 is a cross-sectional view of the structure atcutting line A-A′ in FIG. 1 . FIG. 3 is a cross-sectional view of thestructure at cutting line B-B′ in FIG. 1 . FIG. 4 is an enlarged view ofa cross-section near a contact hole in FIG. 2 . Although no enlargedview near a contact hole in FIG. 3 is depicted, an enlarged view near acontact hole in FIG. 3 would depict a state in which a p⁺-type contactregion 7 a and a p⁺⁺-type plug region 7 b are disposed instead of ann⁺-type emitter region 6 in FIG. 2 . In FIG. 1 , an interlayerinsulating film 8 is indicated by hatching while a barrier metal (metalfilm) 9, a plug electrode (metal layer) 12 and a front electrode (firstelectrode) 13 are not depicted.

The semiconductor device according to the first embodiment depicted inFIGS. 1 to 4 is a RC-IGBT that includes a trench-gate IGBT (firstsemiconductor element) and a free wheeling diode (FWD) (secondsemiconductor element) on a single semiconductor substrate(semiconductor chip). A trench 2 is provided at a predetermined depthfrom a front surface of a semiconductor substrate of an n⁻-type andconstituting an n⁻-type drift layer 1. The trench 2 is provided, forexample, in plural in a striped planar layout an IGBT region (firstformation region) 21 in which an IGBT element structure is provided andin a FWD region (second formation region) 22 in which a FWD elementstructure is provided. A direction (hereinafter, first direction) xalong which the trenches 2 extend is orthogonal to a direction(hereinafter, second direction) y along which the IGBT region 21 and theFWD region 22 are arranged.

A width (hereinafter, simply width) w1 of the trenches 2 along thesecond direction y is reduced, whereby a unit cell (functional unit ofan element) of the IGBT including a single trench 2 may be reduced insize. Trench pitch (an interval at which the trench 2 is disposed) isreduced, whereby a unit cell of the FWD provided in a semiconductor part(mesa part) between a pair of the trenches 2 that are adjacent may bereduced in size. The width w1 and the trench pitch of the trenches 2 arereduced, enabling the semiconductor chip to be reduced in size. Thetrench pitch may be the same for the IGBT region 21 and for the FWDregion 22. When the semiconductor chip is to be reduced in size, forexample, a width (width (hereinafter, mesa width) between adjacenttrenches 2) w2 of the mesa part is narrower than the width w1 of thetrenches 2 (w2<w1).

In each of the trenches 2, a gate insulating film 3 is provided along aninner wall of the trench 2, and a gate electrode 4 is provided on thegate insulating film 3. The trench 2, the gate insulating film 3, andthe gate electrode 4 constitute a MOS gate. In the IGBT region 21, thegate electrode 4 may be embedded in the trench 2 to an extent that thegate electrode 4 opposes the n⁺-type emitter region 6 describedhereinafter, across the gate insulating film 3 provided at a side wallof the trench 2. Therefore, a top surface (surface on a front electrode13 side described hereinafter) of the gate electrode 4 may be slightlyrecessed (hereinafter, a recess 4 a of the top surface of the gateelectrode 4) from a substrate front surface toward a collector side. Inother words, the top surface of the gate electrode 4 may be positionedin the trench 2.

A p-type base region (first semiconductor region) 5 is provided in amesa part (semiconductor part between adjacent trenches 2), at a depthshallower than a depth of the trench 2. A width of the p-type baseregion 5 is equal to the mesa width w2 and the p-type base region 5 isexposed at the side walls of the trenches 2 on each side of the p-typebase region 5. The p-type base region 5 functions as a p-type anoderegion in the FWD region 22. In the IGBT region 21, the n⁺-type emitterregion (second semiconductor region) 6 and the p⁺-type contact region 7a are each selectively provided in the p-type base region 5 so as to beexposed at the substrate front surface. The n⁺-type emitter region 6 andthe p⁺-type contact region 7 a (the p⁺⁺-type plug region 7 b describedhereinafter), for example, are provided in contact with each other in aplanar layout alternating each other repeatedly along the firstdirection x.

The n⁺-type emitter regions 6 provided in different mesa parts, forexample, oppose each other across the trench 2, along the seconddirection y. The p⁺-type contact regions 7 a provided in different mesaparts, for example, oppose each other across the trench 2, along thesecond direction y. Widths of the n⁺-type emitter region 6 and thep⁺-type contact region 7 a are equal to the mesa width w2. The n⁺-typeemitter region 6 and the p⁺-type contact region 7 a are exposed at theside walls of the trenches 2 on each side of the n⁺-type emitter region6 and the p⁺-type contact region 7 a. The p⁺⁺-type plug region 7 b isselectively provided in the p⁺-type contact region 7 a so as to beexposed at the substrate front surface. The p⁺⁺-type plug region 7 b isin contact with the n⁺-type emitter regions 6 adjacent thereto along thefirst direction x. A width of the p⁺⁺-type plug region 7 b issubstantially equal to a width w3 of a contact hole 8 a describedhereinafter. The p⁺⁺-type plug region 7 b is not exposed at the sidewalls of the trenches 2.

The interlayer insulating film 8 is provided on the substrate frontsurface, spanning the IGBT region 21 and the FWD region 22 so as tocover the MOS gate. The interlayer insulating film 8, for example, is asilicon oxide (SiO₂) film containing boron (B) and phosphorus (P) suchas a borophosphosilicate glass (BPSG), and has a boron concentration anda phosphorus concentration higher than those of an interlayer insulatingfilm of an ordinary composition. In particular, in an interlayerinsulating film of an ordinary composition, the boron concentration isabout 2.0 wt % to 2.4 wt % and the phosphorus concentration is about 1.5wt % to 2.5 wt %. The boron concentration of the interlayer insulatingfilm 8 of the present invention, for example, is in a range from about2.6 wt % to 3.8 wt %; and the phosphorus concentration, for example, isin a range from about 3.6 wt % to 4.4 wt %.

For example, the narrower the mesa width w2 is, the smaller the width(width of the mesa part) between adjacent gate electrodes 4 is and therecess 4 a of the top surface of the gate electrode 4 becomes continuousalong the second direction y, whereby unevenness of the substrate frontsurface increases. In this case, in an interlayer insulating film of anordinary composition, even after reflow, unevenness corresponding to theunevenness of the substrate front surface remains at the surface of theinterlayer insulating film (refer to FIG. 19 ). On the other hand, inthe present invention, the boron concentration and the phosphorusconcentration of the interlayer insulating film 8 satisfies thedescribed conditions, whereby fluidity of the interlayer insulating film8 during deposition (formation) of the interlayer insulating film 8, orduring heat treatment (reflow) for planarization of the surface of theinterlayer insulating film 8 may be enhanced. As a result, even in amicrostructure in which the mesa width w2 has been reduced, a surface (atop surface 8 e described hereinafter) of the interlayer insulating film8 becomes substantially flat by reflow.

While the thickness of the interlayer insulating film 8 may be as thickas possible since insulation and separation effects of the interlayerinsulating film 8 may be increased with increased thickness of theinterlayer insulating film 8, at least a thickness t1 of a part of theinterlayer insulating film 8, the part on the mesa part, may be thewidth w3 of the contact hole 8 a or greater (t1≥w3). A reason for thisis as follows. The greater a ratio (=w3/t1) of the width w3 of thecontact hole 8 a to a depth (i.e., the thickness t1 of the part of theinterlayer insulating film 8 on the mesa part) of the contact hole 8 aexceeds 1, the contact hole 8 a becomes more difficult to fill with theplug electrode 12. Therefore, the plug electrode 12 has to be deposited(formed) thickly, however, in this case, deposition of the plugelectrode 12 and etch back of the plug electrode 12 describedhereinafter takes more time. Further, even when the plug electrode 12 isdeposited thickly, the contact hole 8 a may not be filled with the plugelectrode 12. As described above, the top surface 8 e of the interlayerinsulating film 8 becomes substantially flat irrespective of the recess4 a of the top surface of the gate electrode 4 and therefore, athickness t2 of a thickest part of the interlayer insulating film 8 onthe gate electrode 4 is a sum (t2=d1+t1) of a depth d1 from thesubstrate front surface to a bottom of the recess 4 a of the top surfaceof the gate electrode 4 and the thickness t1 of the part of theinterlayer insulating film 8 on the mesa part.

The contact hole 8 a is provided penetrating the interlayer insulatingfilm 8 in a depth direction z. The width w3 of the contact hole 8 a isnarrower than the mesa width w2 (w3<w2). For example, when the mesawidth w2 is about 1 μm, the width w3 of the contact hole 8 a is about0.6 μm or less, whereby a microstructure having a narrow trench pitch isformed. The width w3 of the contact hole 8 a is a width of a lower endside (mesa part side) of the contact hole 8 a, and a width of a contactbetween a semiconductor part and the barrier metal 9 describedhereinafter. A width of an upper end side (the front electrode 13 side)of the contact hole 8 a may be in a range not detrimental to anembedding property of the plug electrode 12 and may be wider than thewidth of the lower end side of the contact hole 8 a.

The n⁺-type emitter region 6 and the p⁺⁺-type plug region 7 b disposedin a planar layout to repeatedly alternate along the first direction xare exposed in the contact hole 8 a. A semiconductor part (mesa part) isslightly removed during formation of the contact hole 8 a, whereby partsof the n⁺-type emitter region 6 and the p⁺⁺-type plug region 7 b exposedin the contact hole 8 a are slightly recessed toward the collector sideand are further on the collector side than is an interface of theinterlayer insulating film 8 and a semiconductor part (hereinafter, therecess is referred to as a groove (first groove) 8 b of the mesa part).A width of the groove 8 b of the mesa part, for example, is equal to thewidth w3 of the contact hole 8 a and an inner wall of the groove 8 b ofthe mesa part is continuous with a side wall (a side surface 8 c of theinterlayer insulating film 8) of the contact hole 8 a. Configuration maybe such that an upper end (end part on the front electrode 13 side)corner part 8 d of the side surface 8 c of the interlayer insulatingfilm 8 is not curved (rounded). A reason for this is that the width ofthe upper end side of the contact hole 8 a becomes too wide, whereby asdescribed above, formation of the plug electrode 12 takes time and theplug electrode 12 may not be embedded in the contact hole 8 a.

In the contact hole 8 a and in the groove 8 b of the mesa part, thebarrier metal 9 is provided along inner walls of the groove 8 b of themesa part and the contact hole 8 a, and the plug electrode 12 isprovided on the barrier metal 9. The barrier metal 9 and the plugelectrode 12 function as the front electrode 13, an emitter electrode,and an anode electrode. The barrier metal 9 is provided only at the sidesurface 8 c of the interlayer insulating film 8 and the inner wall ofthe groove 8 b of the mesa part, and does not extend onto the upper endcorner part 8 d of the side surface 8 c or the top surface 8 e of theinterlayer insulating film 8. In other words, the upper end corner part8 d of the side surface 8 c and the top surface 8 e of the interlayerinsulating film 8 are in contact with the front electrode 13; and thebarrier metal 9 does not oppose across the interlayer insulating film 8in the depth direction z, a part (the gate electrode 4, or parts of themesa part along the side walls of the trenches 2) covered by theinterlayer insulating film 8.

The barrier metal 9, for example, may have a 2-layer structure in whichfirst and second metal films 10, 11 are sequentially stacked. The firstmetal film 10, for example, is a titanium (Ti) film having highadhesiveness with silicon (Si) and converted into a silicide (titaniumsilicide (TiSi)), forming an ohmic contact with the n⁺-type emitterregion 6 and the p⁺⁺-type plug region 7 b. The second metal film 11, forexample, is a titanium nitride (TiN) film. A thickness (total thicknessof the first and the second metal films 10, 11) t3 of the barrier metal9, for example, is substantially equal to a depth d2 of the groove 8 bof the mesa part. The barrier metal 9 is embedded in the groove 8 b ofthe mesa part.

As a material of the plug electrode 12, for example, tungsten (W) havinga high embedding property is used. A top surface of the plug electrode12 may be at a height position substantially equal to that of the topsurface 8 e of the interlayer insulating film 8, or may be slightlyrecessed (hereinafter, a recess 12 a of the top surface of the plugelectrode 12) toward and further on the collector side than is the topsurface 8 e of the interlayer insulating film 8, depending on theprocessing time of etching for forming the plug electrode 12. A depth d3of the recess 12 a of the top surface of the plug electrode 12 may beshallow so that a step formed with the top surface 8 e of the interlayerinsulating film 8 becomes small and, for example, the depth d3 is in arange from about 0 μm to 3 μm. Further, the plug electrode 12 does notextend to the upper end corner part 8 d of the side surface 8 c of theinterlayer insulating film 8.

At the surfaces of the plug electrode 12 and the interlayer insulatingfilm 8, the front electrode 13 having, for example, aluminum-silicon(Al—Si) as a material is provided so as to be embedded in the recess 12a of the top surface of the plug electrode 12. In the IGBT region 21,the front electrode 13 is electrically connected with the n⁺-typeemitter region 6 and the p⁺⁺-type plug region 7 b via the plug electrode12 and the barrier metal 9, and functions as an emitter electrode.Further, in the FWD region 22, the front electrode 13 is electricallyconnected with the p⁺⁺-type plug region 7 b via the plug electrode 12and the barrier metal 9, and functions as an anode electrode.

In a surface layer of a rear surface of the semiconductor substrate, ap⁺-type collector region (third semiconductor region) 14 is provided inthe IGBT region 21; and an n⁺-type cathode region (fourth semiconductorregion) 15 is provided in the FWD region 22. A field stopper layer (notdepicted) may be provided in the surface layer of the rear surface ofthe semiconductor substrate, at a position deeper than that of thep⁺-type collector region 14 and the n⁺-type cathode region 15, the fieldstopper layer suppressing the spread of a depletion layer that spreadsfrom a pn junction between the p-type base region 5 and the n⁻-typedrift layer 1 during an OFF state. A rear electrode (second electrode)16 is provided at the rear surface of the semiconductor substrateoverall and is in contact with the p⁺-type collector region 14 and then⁺-type cathode region 15. The rear electrode 16 is in contact with thep⁺-type collector region 14 and functions as a collector electrode, andis in contact with the n⁺-type cathode region 15 and functions as acathode electrode.

A method of manufacturing the semiconductor device according to thefirst embodiment will be described. FIGS. 5A and 5B are flowchartsdepicting an outline of the method of manufacturing the semiconductordevice according to the first embodiment. FIGS. 6, 8, and 10 are planviews of the semiconductor device according to the first embodiment.FIGS. 7, 9A, 9B, 11A, 11B, 12A, 12B, 13A, 13B, 14A, 14B, 15A, 15B, 16A,16B, 17A, and 17B are cross-sectional views of the semiconductor deviceaccording to the first embodiment during manufacture. FIG. 7 depicts across-sectional view of the structure at cutting line C-C′ in FIG. 6 .FIG. 9A depicts a cross-sectional view of the structure at cutting lineD-D′ in FIG. 8 . FIG. 9B depicts a cross-sectional view of the structureat cutting line E-E in FIG. 8 . FIG. 11A depicts a cross-sectional viewof the structure at cutting line F-F′ in FIG. 10 . FIG. 11B depicts across-sectional view of the structure at cutting line G-G′ in FIG. 10 .FIGS. 12A to 17A depict cross-sections parallel to the second directiony and through the n⁺-type emitter region 6. FIGS. 12B to 17B depictcross-sections parallel to the second direction y and through thep⁺-type contact region 7 a.

First, the trench 2, the gate insulating film 3 and the gate electrode 4are sequentially formed by an ordinary method on a front surface side ofa semiconductor substrate (semiconductor wafer) of an n⁻-type andconstituting the n⁻-type drift layer 1, thereby forming a MOS gate in astriped shape extending along the first direction x (step S1). At thistime, the trench pitch, for example, is determined so that the mesawidth w2 is narrower than the width w1 of the trenches 2 to reduce thesize of the semiconductor chip. Further, the gate insulating film 3, forexample, is formed by thermal oxidation to extend from the inner wall ofthe trench 2 to the semiconductor part (mesa part) surface betweenadjacent trenches 2, however, the part of the gate insulating film 3formed on the surface of the mesa part is removed before formation ofthe interlayer insulating film 8 described hereinafter. FIG. 6 depicts astate in which the part of the gate insulating film 3 formed on thesurface of the mesa part has been removed. Further, the gate electrode 4is formed by, for example, depositing (forming) a poly-silicon layer onthe substrate front surface so as to be embedded in the trenches 2 andetching the poly-silicon layer so that the poly-silicon layer remains inthe trenches 2. Therefore, in the top surface of the gate electrode 4,the recess 4 a is formed at the predetermined depth d1 from thesubstrate front surface corresponding to the processing time of theetching of the poly-silicon layer.

Next, at the substrate front surface overall, for example, a p-typeimpurity such as boron (B) is ion implanted, forming the p-type baseregion 5 in the surface layer of the substrate front surface at a depthshallower than that of the trench 2, the p-type base region 5 spanningthe IGBT region 21 and the FWD region 22 (step S2). At step S2, the gateelectrodes 4 function as a mask, whereby the p-type base region 5 isformed at a predetermined depth in all of the mesa parts of the IGBTregion 21 and the FWD region 22. Next, a resist mask 31 (hatched part inFIG. 6 ) having openings at parts corresponding to a formation region ofthe n⁺-type emitter region 6 is formed. For example, the resist mask 31covering the FWD region 22 and opened at the IGBT region 21 overall isformed. Next, the resist mask 31 and the gate electrodes 4 are used as amask and, for example, an n-type impurity such as arsenic (As) is ionimplanted, forming the n⁺-type emitter region 6 in the surface layer ofthe p-type base regions 5 in the IGBT region 21 (step S3). The ionimplantation at step S3 may be performed with a dose amount of5×10¹⁵/cm² and acceleration energy of 120 keV. The state up to here isdepicted in FIGS. 6 and 7 . Next, the resist mask 31 used in theformation of the n⁺-type emitter region 6 is removed.

Next, a resist mask 32 (hatched part in FIG. 8 ) having openings atparts corresponding to a formation region of the p⁺-type contact region7 a is formed. For example, in the IGBT region 21, a resist mask 32 isformed opened at the FWD region 22 overall and has openings in a stripedshape extending along the second direction y. Next, the resist mask 32and the gate electrodes 4 are used as a mask and, for example, a p-typeimpurity such as boron (B) is ion implanted, forming the p⁺-type contactregion 7 a in the surface layer of the n⁻-type emitter regions 6 in theIGBT region 21. Additionally, in the FWD region 22, the p⁺-type contactregion 7 a is formed in the surface layer of the p-type base regions 5(step S4). The p⁺-type contact region 7 a is formed in a planar layoutin which the p⁺-type contact region 7 a and the n⁺-type emitter region 6alternate repeatedly along the first direction x in the IGBT region 21,and is formed in a striped planar layout extending along the firstdirection x in the FWD region 22. The ion implantation at step S4 may beperformed with a dose amount of 3×10¹⁵/cm² and acceleration energy of120 keV. The state up to here is depicted in FIGS. 8 and 9 . Next, theresist mask 32 used in the formation of the p⁺-type contact region 7 ais removed.

Next, as the interlayer insulating film 8, for example, a BPSG filmsatisfying the boron concentration and the phosphorus concentrationconditions above is deposited (formed) on the substrate front surface soas to cover the gate electrodes 4 (step S5). Next, for example, heattreatment (reflow) at a temperature of about 950 degrees C. in anitrogen (N₂) atmosphere is performed for about 20 minutes, whereby thesurface of the interlayer insulating film 8 is planarized (step S6).Since the boron concentration and the phosphorus concentration of theinterlayer insulating film 8 satisfy the conditions above, irrespectiveof unevenness of the substrate front surface due to the recess 4 a ofthe top surface of the gate electrodes 4, the top surface 8 e of theinterlayer insulating film 8 becomes substantially flat by the reflow.At step S6, reflow is performed at a high temperature enablingplanarization of the top surface 8 e of the interlayer insulating film 8and, for example, the temperature is in a range from about 800 degreesC. to 1000 degrees C. and may be at least 900 degrees C. Next, byphotolithography and etching, the interlayer insulating film 8 ispatterned and the contact holes 8 a are formed, exposing the n⁺-typeemitter regions 6 and the p⁺-type contact regions 7 a (step S7). FIG. 10depicts by hatching, the interlayer insulating film 8 after patterning.

At step S7, at the time of patterning of the interlayer insulating film8, parts (mesa parts) of the n⁺-type emitter regions 6 and the p⁺-typecontact regions 7 a exposed in the contact holes 8 a are slightlyremoved, forming the groove 8 b in the surface of the mesa parts. As aresult, a mathematical area of contact with the barrier metal 9 formedsubsequently increases and therefore, reduction of contact resistancebecomes possible. Alternatively, without increasing the contactresistance, a reduction in size corresponding to the amount of increaseof the mathematical area of contact is possible. Further, after theformation of the contact holes 8 a (process at step S7), reflow at atemperature of about 950 degrees C. for smoothing the upper end cornerpart 8 d of the side surface 8 c of the interlayer insulating film 8 isnot performed. Furthermore, subsequent to the formation of the contactholes 8 a, for example, heat treatment at a temperature of about 800degrees C. or higher is not performed. As a result, the upper end cornerpart 8 d of the side surface 8 c of the interlayer insulating film 8 ismaintained in a substantially angled state, whereby the flatness of thetop surface 8 e of the interlayer insulating film 8 is enhanced. Inparticular, the flatness of the top surface 8 e of the interlayerinsulating film 8 before the formation of the barrier metal 9 describedsubsequently (process at step S9 described hereinafter) is favorable,further enhancing an effect of the present invention. The state up tohere is depicted in FIGS. 10 and 11 .

Next, a resist mask 33 having openings at parts corresponding to aformation region of the p⁺⁺-type plug region 7 b is formed on thesubstrate front surface (on the interlayer insulating film 8). Forexample, the resist mask 33 having openings in a planar layout similarto the resist mask (refer to FIG. 8 ) for forming the p⁺-type contactregion 7 a is formed. Next, the resist mask 33 and the interlayerinsulating film 8 are used as a mask and, for example, a p-type impuritysuch as boron fluorine (BF₂) is ion implanted, forming the p⁺⁺-type plugregion 7 b in the surface layer of the parts of the p⁺-type contactregions 7 a exposed in the contact holes 8 a (step S8). The ionimplantation at step S8 may be performed with a dose amount of3×10¹⁵/cm² and acceleration energy of 30 keV. The state up to here isdepicted in FIGS. 12A and 12B. Next, the resist mask 33 used in theformation of the p⁺⁺-type plug region 7 b is removed.

Next, for example, by a sputtering technique, a metal film 34constituting the barrier metal 9 is formed in the contact holes 8 a,along the side surface 8 c of the interlayer insulating film 8 and theinner wall of the grooves 8 b of the mesa parts (step S9). At this time,the thickness t3 of the metal film 34 is a thickness enabling thegrooves 8 b of the mesa parts to be embedded with the metal film 34. Themetal film 34 has a 2-layer structure in which, for example, a titaniumfilm constituting the first metal film 10 and, for example, a titaniumnitride film constituting the second metal film 11 are sequentiallystacked (refer to FIG. 4 ). At step S9, the metal film 34 is formed onthe surface of the interlayer insulating film 8 overall so as to extendfrom the side surface 8 c of the interlayer insulating film 8 onto theupper end corner part 8 d of the side surface 8 c and the top surface 8e. The state up to here is depicted in FIGS. 13A and 13B.

Next, a part of the metal film 34 (e.g., the titanium film constitutingthe first metal film 10) in contact with a semiconductor part (then⁺-type emitter region 6 and the p⁺⁺-type plug region 7 b) is convertedinto a silicide, for example, by heat treatment (annealing) at atemperature of 660 degrees C. (step S10). Next, for example, a tungstenlayer 35 constituting the plug electrode 12 is deposited (formed), forexample, by a chemical vapor deposition (CVD) method so as to beembedded in the metal film 34 in the contact holes 8 a (step S11). Atstep S11, the tungsten layer 35 is further formed on the surface of themetal film 34 on the top surface 8 e of the interlayer insulating film8. The state up to here is depicted in FIGS. 14A and 14B.

Next, the tungsten layer 35 is subject to etch back until the metal film34 on the top surface 8 e of the interlayer insulating film 8 is exposed(step S12). After the process at step S12, the tungsten layer 35remaining in each contact hole 8 a is the plug electrode 12. The surfaceof the tungsten layer 35 after being subject to etch back may be at asame height position as the top surface 8 e of the interlayer insulatingfilm 8; however, from the perspective of ensuring that the tungstenlayer 35 does not remain on the surface of the metal film 34 on the topsurface 8 e of the interlayer insulating film 8, the surface of thetungsten layer 35 may be subject to etch back so that the tungsten layer35 is slightly lower than the top surface 8 e of the interlayerinsulating film 8. In other words, the tungsten layer 35 is subject toetch back until the surface of the tungsten layer 35 is positionedwithin the contact holes 8 a. In this case, the process time of the etchback is adjusted so that the depth d3 of the recess 12 a of the topsurface of the plug electrode 12 does not become too deep. The state upto here is depicted in FIGS. 15A and 15B.

Next, the metal film 34 is subject to etch back until the top surface 8e of the interlayer insulating film 8 is exposed (step S13). After theprocess at step S13, the metal film 34 remaining in the contact holes 8a is the barrier metal 9. In other words, a part of the barrier metal 9other than the parts formed on the inner walls of the contact holes 8 ais removed by etch back. As described, since the top surface 8 e of theinterlayer insulating film 8 is substantially flat, the top surface 8 eof the interlayer insulating film 8 is entirely exposed substantiallyconcurrently during the etch back of the metal film 34. Further, theprocess time of the etch back of the metal film 34 is adjusted so thatan upper end of the metal film 34 is slightly lower than the top surface8 e of the interlayer insulating film 8 so that the metal film 34 doesnot remain on the upper end corner part 8 d of the side surface 8 c ofthe interlayer insulating film 8. The state up to here is depicted inFIGS. 16A and 16B.

Next, on the interlayer insulating film 8 and the plug electrode 12, thefront electrode 13 is formed to have a thickness of about 5 μm, using,for example, aluminum-silicon as a material (step S14). Next, thesemiconductor substrate is ground from the rear surface side, to aposition of a product thickness used for the semiconductor device (stepS15). Next, for example, a p-type impurity such as boron is ionimplanted in the substrate rear surface overall, forming the p⁺-typecollector region 14 in the surface layer of the rear surface of thesemiconductor substrate overall (step S16). The state up to here isdepicted in FIGS. 17A and 17B. Next, on the substrate rear surface, aresist mask (not depicted) having an opening at a part corresponding toa formation region of the n⁺-type cathode region is formed. Next, theresist mask is used as a mask and, for example, an n-type impurity suchas phosphorus is ion implanted, forming the n⁺-type cathode region 15 inthe surface layer of the rear surface of the semiconductor substrate, inthe FWD region 22 (step S17).

Next, after the resist mask used in the formation of the n⁺-type cathoderegion 15 is removed, the p⁺-type collector region 14 and the n⁺-typecathode region 15 are activated by laser annealing (step S18). Next,after the entire substrate front surface is covered by, for example, apassivation film (not depicted) such as a polyimide film, thepassivation film is patterned, exposing the front electrode 13 and eachelectrode pad (step S19). After the rear surface of the semiconductorsubstrate is ground and before formation of the p⁺-type collector region14, formation and patterning of the passivation film may be performed.After the rear surface of the semiconductor substrate is ground, thepassivation film of the substrate front surface is formed, whereby therear surface of the semiconductor substrate may be ground withoutadverse effects of a level difference of the substrate front surface dueto the passivation film. Further, after formation of the front electrode13 and before grinding of the rear surface of the semiconductorsubstrate, formation and patterning of the passivation film may beperformed.

Next, helium (He) or an electron beam is irradiated from the frontsurface side or the rear surface side of the semiconductor substrate,thereby introducing into the n⁻-type drift layer 1, lattice defectsconstituting a lifetime killer, whereby the lifetime of carriers in then⁻-type drift layer 1 is reduced (step S20). Lattice defects also occurin the mesa parts due to this lifetime control. When lattice defectsoccurring in the mesa parts are present in a part along the MOS gates ofthe mesa parts, the gate threshold voltage decreases. A part along a MOSgate of a mesa part is a part of the p-type base region 5 sandwichedbetween the n⁺-type emitter region 6 and the n⁻-type drift layer 1,i.e., a part formed by an n-type inversion layer (channel) in the ONstate. Therefore, next, in a hydrogen (H₂) atmosphere, for example, heattreatment (hydrogen annealing) at a temperature of 350 degrees C. isperformed, recovering the lattice defects of the mesa parts (step S21).

As described, during the hydrogen annealing at step S21, on the topsurface 8 e and the upper end corner part 8 d of the side surface 8 c ofthe interlayer insulating film 8, the barrier metal 9 is not present.Thus, diffusion of hydrogen atoms in the hydrogen atmosphere is notsuppressed by the barrier metal 9 and therefore, the hydrogen atoms passthrough the front electrode 13 and the interlayer insulating film 8, andreach the lattice defects of the mesa parts. As a result, the latticedefects of the mesa parts are recovered, enabling the gate thresholdvoltage to be recovered to about a same level as before the irradiationof the helium or electron beam. Next, the rear electrode 16 is formed atthe rear surface of the semiconductor substrate overall, in contact withthe p⁺-type collector region 14 and the n⁺-type cathode region 15 (stepS22). Thereafter, the semiconductor wafer is cut (diced) into individualchips, completing the RC-IGBT having the trench gate structure depictedin FIGS. 1 to 4 .

As described, according to the first embodiment, the barrier metal issubject to etch back continuous with the etch back of the plugelectrodes, whereby the top surface of the interlayer insulating filmmay be easily exposed. As a result, on the gate electrodes, the frontelectrode is stacked sandwiching the interlayer insulating filmtherebetween, and the barrier metal is not present between the frontelectrode and the interlayer insulating film on the gate electrodes.Therefore, during hydrogen annealing, hydrogen atoms may pass throughthe interlayer insulating film from the front electrode side and reachthe mesa parts. Thus, even when lattice defects are generated in themesa parts by the helium or electron beam irradiation for the lifetimecontrol and the gate threshold voltage decreases, recovery effects ofthe gate threshold voltage by the hydrogen annealing may be easily andstably obtained. Further, according to the first embodiment, the barriermetal is not present on the top surface of the interlayer insulatingfilm, whereby the top surface part of the interlayer insulating filmbecomes an escape path for charge accumulated in the gate insulatingfilm. As a result, charge does not remain in the gate insulating film,enabling the durability of the gate insulating film to be enhancedcompared to the first conventional structure in which the entire surfaceof the interlayer insulating film is covered by the barrier metal.

Further, a patterning process for barrier metal and a CMP process forbarrier metal are not necessary like in the conventional arts.Therefore, decreases in reliability due to patterning variation of thebarrier metal and increases in the number or processes and cost may beprevented. Further, according to the first embodiment, a BPSG filmhaving a higher boron concentration and phosphorus concentration thanthose of an interlayer insulating film of an ordinary composition isused, whereby fluidity during deposition of the interlayer insulatingfilm and during reflow may be enhanced. Therefore, even when the trenchpitch is reduced to decrease size, irrespective of unevenness of thesubstrate front surface, the top surface of the interlayer insulatingfilm after reflow may be made substantially flat. As a result, the topsurface of the interlayer insulating film is exposed substantiallyconcurrently with etch back of the barrier metal and excess barriermetal remaining on the top surface of the interlayer insulating film maybe prevented. As a result, recovery effects of the gate thresholdvoltage may be further enhanced by hydrogen annealing. Further, sincethe top surface of the interlayer insulating film is exposedsubstantially concurrently with etch back of the barrier metal, the etchback time of the barrier metal may be reduced as compared to a case inwhich the interlayer insulating film is formed by an ordinarycomposition.

Flatness of the top surface 8 e of the interlayer insulating film 8 wasverified. FIG. 18 is a cross-sectional view schematically depicting astate after reflow of an interlayer insulating film of a semiconductordevice according to a first example. FIG. 19 a cross-sectional viewschematically depicting a state after reflow of an interlayer insulatingfilm of a semiconductor device for comparison. First, a sample(hereinafter, the first example) was prepared by performing theformation of the MOS gates (step S1) to the formation of the frontelectrode 13 (step S14) according to the method of manufacturing thesemiconductor device according the first embodiment described above. Inother words, in the first example, a BPSG film having a boronconcentration and a phosphorus concentration that are higher than thoseof an interlayer insulating film of an ordinary composition was formedas the interlayer insulating film 8. Formation of the semiconductorregions of the mesa part (steps S2 to S4, S6 above) was omitted. Thetrench 2 had a width that decreased from an opening side toward thebottom, where the width w1 on the opening side was 1.34 μm and at widthw4 near an intermediate depth was 1.13 μm. A depth d4 of the trench 2was 5.26 μm and the mesa width w2 was 1.06 μm.

For comparison, a sample was prepared by forming an interlayerinsulating film 108 of an ordinary composition (hereinafter, comparisonexample). A method of manufacturing the comparison example was similarto that of the first example excluding the composition of the interlayerinsulating film 108 which differed. In the comparison example, while adepth d104 of a trench 102 was slightly deeper than that in the firstexample, other dimensions were substantially equal to those of the firstexample. In particular, the trench 102 had a width that decreased fromthe opening side toward the bottom, where a width w101 on the openingside was 1.35 μm, a width w104 at an intermediate depth was 1.12 μm, anda width w105 of the bottom was 0.92 μm. A depth d104 of the trench 102was 6.24 μm and a mesa width w102 was 1.32 μm near an intermediate depthof the trench 102. In FIG. 19 , reference characters 101, 103, 104, 108a, 108 b, 109, 112, and 113 are an n⁻-type drift layer, a gateinsulating film, a gate electrode, a contact hole, a mesa part groove, abarrier metal, a plug electrode, and a front electrode, respectively.

The states of the interlayer insulating film 8 of the first example andthe interlayer insulating film 108 of the comparison example afterreflow were observed using a scanning electron microscope (SEM) and theresults are depicted schematically in FIGS. 18 and 19 . From the resultsdepicted in FIG. 19 , in the comparison example, at the substrate frontsurface, great unevenness was confirmed to occur at a top surface 108 eof the interlayer insulating film 108 corresponding to unevennessoccurring due to a recess 104 a of the top surface of the gate electrode104. In contrast, from the results depicted in FIG. 18 , in the firstexample, at the substrate front surface, even when unevenness occurreddue to the recess 4 a of the top surface of the gate electrode 4, thetop surface 8 e of the interlayer insulating film 8 was confirmed to beflat.

The gate threshold voltage of the semiconductor device according to thefirst embodiment was verified. FIG. 20 is characteristics diagram ofgate threshold voltage characteristics of a semiconductor deviceaccording to a second example. An RC-IGBT (hereinafter, second example)was fabricated according to the method of manufacturing thesemiconductor device according to the first embodiment described aboveunder the conditions described above. In other words, in the secondexample, a BPSG film having a boron concentration and a phosphorusconcentration that are higher than those of an interlayer insulatingfilm of an ordinary composition was formed as the interlayer insulatingfilm 8, and the top surface 8 e of the interlayer insulating film 8 wasplanarized. Further, in the second example, the barrier metal 9 on thetop surface 8 e of the interlayer insulating film 8 was removed by etchback and, the top surface of the interlayer insulating film 8 and thefront electrode 13 were in contact with each other. The lifetime controlof irradiating helium was performed (process at step S20).

For comparison, an RC-IGBT (hereinafter, conventional example) wasfabricated having the first conventional structure in which a BPSG filmof an ordinary composition was formed as an interlayer insulating filmand a front electrode was formed on the interlayer insulating film via abarrier metal, without removing the barrier metal that extended onto thetop surface of the interlayer insulating film from an inner wall of acontact hole. Manufacturing conditions and configuration of theconventional example excluding the composition of the interlayerinsulating film and disposal of the barrier metal were similar to thoseof the second example. With respect to the second example and theconventional example, the gate threshold voltage was measured before thehelium irradiation, and after the subsequent hydrogen annealing; theresults are depicted in FIG. 20 . Drain current at the time ofmeasurement of the gate threshold voltage was 200 mA.

As depicted in FIG. 20 , in the conventional example, the gate thresholdvoltage was confirmed to greatly decrease due to the helium irradiationand thereafter, even when the hydrogen annealing was performed, the gatethreshold voltage could not be recovered. A reason for this is that thediffusion of hydrogen atoms from the front electrode side toward theinterlayer insulating film was suppressed by the barrier metal on thetop surface of the interlayer insulating film and thus, the hydrogenatoms do not reach the front surface of the semiconductor substrate,whereby the lattice defects of the mesa part could not be recovered. Onthe other hand, in the second example, variation (decrease) of the gatethreshold voltage due to the helium irradiation was confirmed to be lessthan that in the conventional example. A reason for this is that thebarrier metal 9 is not present on the top surface 8 e of the interlayerinsulating film 8 or on the upper end corner part 8 d of the sidesurface 8 c, whereby the hydrogen atoms passed through the frontelectrode 13 and the interlayer insulating film 8, and reached thelattice defects of the mesa part. Further, in the second example, thegate threshold voltage, which decreased due to the helium irradiationfor the lifetime control, was confirmed to be recovered to about a samelevel as before the helium irradiation, by hydrogen annealing. In otherwords, it was found that even when the barrier metal 9 on the topsurface 8 e of the interlayer insulating film 8 is removed by etch backlike in the present invention, hydrogen atoms can reach inside thesemiconductor substrate during the hydrogen annealing, and the latticedefects of the mesa part can be recovered.

The state of the semiconductor device according to the first embodimentafter implementation was verified. A structure of a semiconductor modulein which the semiconductor device according to the first embodiment isimplemented is described in a third embodiment described hereinafter.FIG. 21 is a cross-sectional view schematically depicting a normal stateof a front electrode of a semiconductor device according to a thirdexample after wiring. FIG. 22 is a cross-sectional view schematicallydepicting a state in which a gap of the front electrode of thesemiconductor device according to the third example occurs after wiring.An IGBT (hereinafter, the third example) was fabricated according to themethod of manufacturing the semiconductor device according to the firstembodiment described above. The front electrode 13 of the third examplehas a stacked structure in which an aluminum film (may be an aluminumalloy film such as aluminum-silicon, hereinafter, simply “aluminum film”(metal electrode film of the lowest layer)) 17 and a nickel film (may bea nickel alloy film such as nickel-phosphorus, hereinafter, simply“nickel film” (metal electrode film of an upper layer)) 18 aresequentially stacked. The normal state of the third example is depictedin FIG. 21 and a not normal state is depicted in FIG. 22 .

The normal state of the third example is a state in which in all regions(for example, the active region) in which the front electrode 13 isdisposed, the interlayer insulating film 8 and the plug electrode 12 arecovered by the aluminum film 17. The not normal state of the thirdexample is a state in which a gap 41 occurs in the aluminum film 17 at aregion in which the front electrode 13 is disposed, and at a location ofthe gap 41 of the aluminum film 17, the interlayer insulating film 8 orthe plug electrode 12 is in contact with the nickel film 18. The gap 41of the aluminum film 17 is a location where the aluminum film 17 ispartially not present between the nickel film 18 and, the interlayerinsulating film 8 or the plug electrode 12.

As an example of the gap 41 occurring in the aluminum film 17, forexample, foreign matter such as residue (particles) remaining on theinterlayer insulating film 8 before formation of the aluminum film 17may be given. In this case, at a part where the aluminum film 17 coversforeign matter, a film having a raised bump along the foreign matter isformed. At a border of the part having the raised bump due to theforeign matter and a flat part without foreign matter, the thickness ofthe aluminum film 17 is thin. Therefore, at the surface of the aluminumfilm 17, when the aluminum film 17 is etched before plating of thenickel film 18, the part of the aluminum film 17 having the raised bumpdue to the foreign matter is removed with the foreign matter and asdepicted in FIG. 22 , the gap 41 is likely to occur.

In the first conventional structure (refer to FIG. 23 ) described above,when the gap 221 occurred in the aluminum film 214, as described above,the crack 223 was confirmed to occur in the interlayer insulating film210, and the barrier metal 211 and the interlayer insulating film 210were confirmed to peel due to heat stress resulting from temperatureincrease of the nickel film 215. Further, cracks in the semiconductorsubstrate beyond the interlayer insulating film 210 were confirmed. As aresult, leak current was confirmed to increase, leading to elementdestruction such as a state in which leak current constantly flowed andthe device could not be turned OFF. In other words, in the firstconventional structure, aging at the time of implementation and due tosubsequent heat cycles was confirmed to progress quickly, and the lifespan was confirmed to be shorter than that of the second conventionalstructure not using plug electrodes.

In contrast, in the third example, in both the normal state (FIG. 21 )and the not normal state (FIG. 22 ), life span (progression of aging)and predetermined characteristics of about a same level as those of thesecond conventional structure were confirmed to be maintained. A reasonfor this is as follows. The barrier metal 9 having high adhesivenesswith the nickel film 18 is not present on the top surface 8 e of theinterlayer insulating film 8 or the upper end corner part 8 d of theside surface 8 c. Therefore, the nickel film 18 contacts the interlayerinsulating film 8 at the top surface 8 e of the interlayer insulatingfilm 8 and the upper end corner part 8 d of the side surface 8 c (partencompassed by dashed line indicated by reference numeral 42). As aresult, adhesion of the nickel film 18 and the interlayer insulatingfilm 8 is lower as compared to the first conventional structure in whichthe surface of the interlayer insulating film 210 overall is covered bythe barrier metal 211. Therefore, heat stress due to temperatureincrease of the nickel film 18 at the time of implementation andsubsequent heat cycles is less likely to be applied to the interlayerinsulating film 8 cracks do not occur in the interlayer insulating film8. Further, the interlayer insulating film 8 does not peel andtherefore, insulation by the interlayer insulating film 8 may bemaintained at about a same level as that of the second conventionalstructure. Further, the plug electrode 12 has a high mechanical strengthand therefore, even when adhesion of the nickel film 18 and the plugelectrode 12 is high, cracks caused by heat stress due to temperatureincrease of the nickel film 18 do not occur in the plug electrode 12.Further, even assuming that the plug electrode 12 peels from the contacthole 8 a due to heat stress resulting from temperature increase of thenickel film 18, the inventor confirmed that insulation by the interlayerinsulating film 8 could be secured, and that the element operatedproperly.

A structure of the semiconductor device according to a second embodimentwill be described. FIG. 25 is a cross-sectional view of a structure ofthe semiconductor device according to the second embodiment. FIG. 25depicts a cross-sectional view of the structure at cutting line A-A′ inFIG. 1 . Although a cross-sectional view of the structure of thesemiconductor device according to the second embodiment at cutting lineB-B′ in FIG. 1 is not depicted, in the cross-sectional view depicted inFIG. 3 , configuration is similar to that depicted in FIG. 25 , in whicha barrier metal 19 and a slit 19 a described hereinafter areadditionally provided.

FIG. 26 is a plan view of a layout when viewing a slit of the barriermetal in FIG. 25 from the front surface side of the semiconductorsubstrate. FIGS. 27 and 28 are plan views of other examples of a layoutwhen viewing a slit of the barrier metal in FIG. 25 from the frontsurface side of the semiconductor substrate. FIGS. 26 to 28 do notdepict the front electrode 13 and depict a state in which the topsurface 8 e of the interlayer insulating film 8 is exposed at the slit19 a of the barrier metal 19.

The semiconductor device according to the second embodiment differs fromthe semiconductor device according to the first embodiment in that notonly are the side surface 8 c of the interlayer insulating film 8 andthe inner wall of the groove 8 b of the mesa part covered by the barriermetal 19, but the upper end corner part 8 d of the side surface 8 c andthe top surface 8 e of the interlayer insulating film 8 are furthercovered and the slit 19 a is provided at a part of the barrier metal 19.The slit 19 a is a groove (second groove) that penetrates the barriermetal 19 in a thickness direction and reaches the interlayer insulatingfilm 8.

In other words, a part of the interlayer insulating film 8 is exposed atthe slit 19 a of the barrier metal 19. The front electrode 13 isembedded in the slit 19 a of the barrier metal 19. FIG. 25 , forexample, depicts a case where the front electrode 13 has a 2-layerstructure in which the aluminum film 17 and the nickel film 18 aresequentially stacked, and the aluminum film 17 of the lowest layer ofthe front electrode 13 is embedded in the slit 19 a of the barrier metal19.

The slit 19 a of the barrier metal 19, for example, may be disposed at aposition exposing the top surface 8 e of the interlayer insulating film8. Reasons for this, for example, are as follows. A first reason is thateffects similar to those of the first embodiment (the slit 19 a is notprovided in the barrier metal 19) are obtained. A second reason is thatduring hydrogen annealing, hydrogen reaches inside the semiconductorsubstrate through a region of the slit 19 a where the barrier metal 19is not present, enabling the lattice defects of the mesa part to berecovered. A third reason is that variation of the thickness of thebarrier metal 19 may be suppressed, facilitating stable securement ofadhesiveness of the barrier metal 19 and the interlayer insulating film8.

Further, the slit 19 a may be provided in plural in the barrier metal19. Even when the slit 19 a is provided in plural in the barrier metal19, all of the slits 19 a, for example, are disposed a positionsexposing the top surface 8 e of the interlayer insulating film 8. As aresult, during hydrogen annealing, hydrogen reaches inside thesemiconductor substrate through a region of the slit 19 a where thebarrier metal 19 is not present, enabling the lattice defects of themesa part to be recovered. Further, compared to a case in which some (orall) of the slits 19 a are provided at the side surface 8 c of theinterlayer insulating film 8, adhesiveness of the interlayer insulatingfilm 8 and the aluminum film 17 may be secured.

The barrier metal 19 covers the top surface 8 e of the interlayerinsulating film 8, at a location other than that where the slit 19 a isprovided. Therefore, when a gap (refer to reference numeral 41 in FIG.22 ) occurs in the aluminum film 17, the barrier metal 19 and the nickelfilm 18 of the upper layer of the aluminum film 17 may contact eachother at the top surface 8 e of the interlayer insulating film 8;however, no problem like that described of the first conventionalstructure (refer to FIG. 23 ) occurs. A reason for this is that the slit19 a is provided, whereby through the barrier metal 19, a mathematicalarea of the contact of the interlayer insulating film 8 and the nickelfilm 18 decreases and the heat stress applied to the interlayerinsulating film 8 decreases.

Further, even when the top surface 8 e of the interlayer insulating film8 and the upper end corner part 8 d of the side surface 8 c arepartially covered by the barrier metal 19, the recovery effects of thegate threshold voltage by the hydrogen annealing at step S21 may besecured. A reason for this is that at the top surface 8 e of theinterlayer insulating film 8, diffusion distance of hydrogen in Si(semiconductor substrate) is sufficiently greater than a width(hereinafter, a remaining width w6 of the part 19 b of the barrier metal19 on the top surface 8 e of the interlayer insulating film 8) w6 of thebarrier metal 19 that remains. The remaining width w6 of the part 19 bof the barrier metal 19 on the top surface 8 e of the interlayerinsulating film 8 is the width, along the second direction y, of partsopposing each other across the slit 19 a of the barrier metal 19 on thetop surface 8 e of the interlayer insulating film 8.

Further, the slit 19 a of the barrier metal 19, for example, may beprovided in a striped layout extending substantially along the firstdirection x similarly to the contact holes 8 a, as viewed from the frontsurface side of the semiconductor substrate (refer to FIG. 26 ). As aresult, during hydrogen annealing, hydrogen reaches inside thesemiconductor substrate through a region of the slit 19 a where thebarrier metal 19 is not present, enabling the lattice defects of themesa part to be recovered. Further, the side wall of the slit 19 a ofthe barrier metal 19 may be tilted with respect to the surface of theinterlayer insulating film 8. In other words, a cross-sectional shape ofthe slit 19 a may be substantially trapezoidal.

Further, the slit 19 a of the barrier metal 19, as viewed from the frontsurface side of the semiconductor substrate, for example, may beprovided in a lattice-like layout in which lines extending substantiallyalong the first direction x and lines extending substantially along thesecond direction y intersect (refer to FIG. 27 ). In this case, near acenter between adjacent contact holes 8 a, the slit 19 a is disposed ina linear layout extending substantially along the first direction x.Additionally, between adjacent contact holes 8 a and near the contactholes 8 a, the part 19 b of the barrier metal 19 on the top surface 8 eof the interlayer insulating film 8 and the slit 19 a are disposed toalternate repeatedly along the first direction x.

Further, a slit 19 a′ of a barrier metal 19′, as viewed from the frontsurface side of the semiconductor substrate, for example, may be providein a striped layout extending substantially along the second direction y(refer to FIG. 28 ). In this case, a part 19 b′ of the barrier metal 19′on the top surface 8 e of the interlayer insulating film 8 and the slit19 a′ are provided spanning between adjacent contact holes 8 a.Additionally, the part 19 b′ of the barrier metal 19′ on the top surface8 e of the interlayer insulating film 8 and the slit 19 a′ are disposedto alternate repeatedly along the first direction x. In FIGS. 26 to 28 ,the part of the barrier metal 19 on the side surface 8 c of theinterlayer insulating film 8 is not depicted.

A width (width along the second direction y) w5 of the slit 19 a of thebarrier metal 19, for example, may be narrower than a width (i.e., awidth (width of the gate electrode 4 along the second direction y) w11)between an interface of the gate electrode 4 and a part of the gateinsulating film 3 at the side wall of the trench 2. A reason for this isas follows. A state of a part 3 a of the gate insulating film 3 near aninterface of the p-type base region and the n⁺-type emitter region 6influences the gate threshold voltage the most. The width of w5 of theslit 19 a of the barrier metal 19 is made narrower than the width w11 ofthe gate electrode 4, whereby the part 3 a of the gate insulating film 3most influencing the gate threshold voltage may be covered by thebarrier metal 19, via the interlayer insulating film 8 along the depthdirection z. Therefore, the remaining width w6 of the part 19 b of thebarrier metal 19 on the top surface 8 e of the interlayer insulatingfilm 8 may be a width enabling the part of the gate insulating film 3 atthe side wall of the trench 2 to be covered by the barrier metal 19, viathe interlayer insulating film 8 along the depth direction z.

A method of manufacturing a semiconductor device according to the secondembodiment, for example, includes in the method of manufacturing thesemiconductor device according to the first embodiment (refer to FIGS.5A and 5B), using an etching mask having openings corresponding toformation regions of the slit 19 a and selectively etching the barriermetal 19, in place of the process (etch back of the barrier metal) atstep S13.

As described, according to the second embodiment, a slit is provided inthe barrier metal, whereby a part not covered by the barrier metal atthe surface of the interlayer insulating film may be selectivelyremoved, enabling effects similar to those of the first embodiment to beobtained.

In the third embodiment, a structure of a semiconductor module in whichthe semiconductor device according to the first embodiment isimplemented will be described. FIG. 29 is a plan view of a layout whenviewing the semiconductor module according to the third embodiment froma front surface side of the semiconductor chip. FIG. 30 is across-sectional view of a structure at cutting line H-H′ in FIG. 29 .The semiconductor module according to the third embodiment depicted inFIGS. 29 and 30 is a package 50 in which a semiconductor chip 51 ismounted and that has a structure of the semiconductor device accordingto the first embodiment. FIGS. 29 and 30 depict a case in which 2 of thesemiconductor chips 51 are mounted.

The rear electrode 16 of the semiconductor chip 51 is joined, via asolder layer 61, to a first heat sink 52 disposed on the rear surfaceside of the semiconductor chip 51. The front electrode 13 of thesemiconductor chip 51 is joined, via a solder layer 62, to one mainsurface of a terminal 53 disposed on the front surface side of thesemiconductor chip 51. The terminal 53 has a function of electricallyand thermally relaying the semiconductor chips 51 and a second heat sink54 described hereinafter. The other main surface of the terminal 53 isjoined to the second heat sink 54, via a solder layer 63.

In other words, the semiconductor chips 51 are disposed so as to besandwiched between the first and the second heat sinks 52, 54, and maydissipate heat from both surfaces (the front surface and the rearsurface). Joint portions 52 a, 54 a extending from the first heat sink52 to which one semiconductor chip 51 of the two the semiconductor chips51 is joined and from the second heat sink 54 to which the othersemiconductor chip 51 is joined are joined via a solder layer 64. As aresult, the first and the second heat sinks 52, 54 are electricallyconnected to each other.

The two semiconductor chips 51, for example, respectively constitute aFWD and an IGBT of a high potential side (upper arm) of two IGBTsserially connected and constituting one phase (not depicted) of a powerconversion bridge circuit and a FWD and an IGBT of a low potential side(lower arm). The semiconductor chip 51, one end part of a main terminal56, and one end part of a signal terminal 57 are sealed by a sealingresin 55 filled between the two semiconductor chips 51 and between thefirst and the second heat sinks 52, 54 opposing each other andsandwiching the semiconductor chips 51.

As the main terminal 56, at least, a high-potential power supplyterminal 56 a, a low-potential power supply terminal 56 b, and an outputterminal 56 c respectively connected to one end part of a non-depictedhigh-potential power supply line, a non-depicted low-potential powersupply line, and an output terminal 56 c of the package 50 are provided.The one end part of the signal terminal 57 is electrically connectedwith an electrode pad of the corresponding semiconductor chip 51, via abonding wire (not depicted). The other end part of the main terminal 56and the other end part of the signal terminal 57 are lead out from thepackage 50.

In the foregoing, the present invention, without limitation to theembodiments described, is applicable to semiconductor devices of variousconfigurations that include a plug electrode provided in a contact holevia a barrier metal and various configurations in which problems occurdue to lattice defects generated in the semiconductor substrate byirradiation of helium or an electron beam. For example, in theembodiments, while an RC-IGBT in which a trench-gate IGBT and a FWD areprovided on a single semiconductor substrate is described as an example,without limitation to a trench gate structure, the present invention isfurther applicable to a semiconductor device having a planar gatestructure in which a MOS gate is provided in a plate-like shape on thesubstrate front surface. Further, in the embodiments described, while acase in which plural MOS gates are included has been described as anexample, even when one MOS gate is included, similar effects areachieved. Further, in the embodiments described, while a case in which atrench having a width that is constant from the opening side toward thebottom has been described as an example, the width of the trench maydecrease from the opening side toward the bottom. Further, in thepresent invention, dimensions, impurity concentrations, etc. of partsare variously set according to required specifications. Further, in theembodiments described, while semiconductor regions constituting thedevice are formed by diffusion regions formed by ion implantation,without limitation hereto, any one or more of the semiconductor regionsconstituting the device may be a deposition layer formed by epitaxialgrowth. Further, other than a plating film formed by an electrolessplating method, the nickel film may be a sputtered film formed by asputtering method. Further, in the present embodiments, while a firstconductivity type is as assumed to be an n-type and a secondconductivity type is assumed to be a p-type, the present invention issimilarly implemented when the first conductivity type is a p-type andthe second conductivity type is an n-type.

According to the embodiments of the present invention, the metal filmconstituting the barrier metal is subject to etch back continuous withthe etch back of the metal layer constituting the plug electrode,whereby the top surface (surface on the first electrode side) of theinsulating film covering the gate electrode may be exposed. As a result,the first electrode is stacked on the gate electrode sandwiching theinsulating film therebetween and the metal film constituting the barriermetal is not present between the insulating film on the gate electrodeand the first electrode. Therefore, during hydrogen annealing (heattreatment in a hydrogen atmosphere), hydrogen atoms may pass through theinsulating film from the first electrode side and reach the mesa part(part of the semiconductor substrate sandwiched between adjacenttrenches). As a result, even when lattice defects are generated in themesa part by irradiation of light ions or an electron beam for lifetimecontrol and the gate threshold voltage decreases, the lattice defects ofthe mesa part may be recovered by the hydrogen annealing thereafter,enabling the gate threshold voltage to be recovered.

The semiconductor device and the method of manufacturing a semiconductordevice according to the embodiments of the present invention achieve aneffect in that even when lifetime control is performed, predeterminedcharacteristics of a semiconductor device having a structure in which aplug electrode is embedded in a contact hole via a barrier metal may bestably and easily obtained.

As described, the semiconductor device and the method of manufacturing asemiconductor device according to the embodiments of the presentinvention are useful for semiconductor devices having a trench gatestructure and are particularly suitable for semiconductor devices havinga microstructure of a narrow trench pitch.

Although the invention has been described with respect to a specificembodiment for a complete and clear disclosure, the appended claims arenot to be thus limited but are to be construed as embodying allmodifications and alternative constructions that may occur to oneskilled in the art which fairly fall within the basic teaching hereinset forth.

What is claimed is:
 1. A semiconductor device, comprising: a trenchprovided at a predetermined depth from a first main surface of asemiconductor substrate; a gate electrode provided via a gate insulatingfilm in the trench; an insulating film provided on the first mainsurface of the semiconductor substrate and covering the gate electrode;a contact hole penetrating the insulating film in a depth direction andreaching the semiconductor substrate; a first groove provided in asemiconductor part of the semiconductor substrate exposed in the contacthole, a metal film provided from a side wall of the contact hole andalong an inner wall of the first groove, the metal film adhering to thesemiconductor part; a second groove provided in a part of the metal filmand penetrating the metal film in a direction of thickness and reachinga surface of the insulating film facing toward the first electrode; ametal layer embedded in the metal film in the contact hole; and a firstelectrode provided at a surface of the metal layer and the insulatingfilm, wherein a surface of the gate electrode is positioned within thetrench.
 2. The semiconductor device according to claim 1, wherein theinsulating film is a silicon oxide film containing boron at an impurityconcentration in a range from 2.6 wt % to 3.8 wt % and phosphorus at animpurity range from 3.6 wt % to 4.4 wt %.
 3. The semiconductor deviceaccording to claim 1, wherein the insulating film has a part that is onthe gate electrode and that has a thickness equal to a sum of athickness of a part of the insulating film other than the part on thegate electrode and a depth from the first main surface of thesemiconductor substrate to the surface of the gate electrode.
 4. Thesemiconductor device according to claim 1, further comprising aplurality of trenches including the trench wherein lattice defects areintroduced in a part of the semiconductor substrate other than a partsandwiched between adjacent trenches, the lattice defects beingintroduced by irradiation of helium or an electron beam.
 5. Thesemiconductor device according to claim 1, wherein the metal film ispositioned closer to the semiconductor part than is a corner part wherea surface of the insulating film facing toward the first electrode and aside surface of the insulating film exposed at the contact hole meet. 6.The semiconductor device according to claim 5, wherein the firstelectrode has a stacked structure in which two or more metal electrodefilms of differing materials are sequentially stacked, and a lowermostmetal electrode film of the two or more metal electrode films is analuminum film or an aluminum alloy film, and covers a part of at leastone of the insulating film and the metal layer.
 7. The semiconductordevice according to claim 6, wherein the first electrode includes anickel film or a nickel alloy film stacked as an upper layer metalelectrode film on the lowermost metal electrode film.
 8. Thesemiconductor device according to claim 1, wherein the second groove hasa slit shape provided in a part of the metal film and penetrating themetal film in the direction of thickness.
 9. The semiconductor deviceaccording to claim 1, wherein the first electrode covers surfaces of theinsulating film and the metal layer overall.